Date: 27/04/2025

PVD semiconductor equipment: Overview of market and technology with vendor analysis

Physical Vapor Deposition (PVD) is a vacuum-based thin-film deposition technique where a solid material (the "target") is vaporized and deposited onto a substrate, forming a uniform, high-purity coating. In semiconductors, PVD is used to deposit metals (e.g., aluminum, copper, titanium) and compounds (e.g., titanium nitride, silicon dioxide) to create conductive interconnects, barrier layers, and insulating films.
The article offers an in-depth exploration of Physical Vapor Deposition (PVD) in semiconductor manufacturing. It details PVD's role in depositing thin films for integrated circuits and microelectronics, explaining its vacuum-based process, which vaporizes materials mainly in semiconductor manufacturing for conductive and insulating layers. The article outlines key PVD methods sputtering, thermal evaporation, and arc vapor deposition highlighting their applications, advantages like high purity and scalability, and challenges such as high costs and line-of-sight deposition issues.

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