Date: 27/04/2025

Intel introduces next-gen AI-enhanced SDV SoC with multi-node chiplet architecture

At Auto Shanghai 2025, Intel introduced its second-generation software-defined vehicle (SDV) system-on-chip (SoC), featuring the automotive industry’s first multi-node chiplet architecture. Designed for intelligent, connected vehicles, the SoC supports customizable compute, graphics, and AI capabilities. Intel also announced new collaborations with ModelBest and Black Sesame Technologies.
The SDV SoC uses a multi-node chiplet architecture, integrating silicon for each functional block. It delivers up to 10x AI performance for generative and multimodal AI and up to 3x graphics performance for enhanced human-machine interfaces. The SoC supports 12 camera lanes for expanded camera input and image processing.

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