Date: 12/03/2025

Sachin Tendulkar invested RRP Electronics partners with Deca Tech on chip packaging

Sachin Tendulkar invested RRP Electronics has formed strategic alliance with US-based Deca Technologies, where RRP to integrate Deca’s innovative Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
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