Selected online news stories from Electronics Engineering Media for 4th Week of Jun 23

Date: 23/06/2023

Can AMD’s MI300X Take On Nvidia’s H100?

How generative AI puts the magic back in hardware design

Monolithic integration of III-V lasers and silicon photonics

Four megatrends in the automotive industry

Chip makers go head to head over WiFi 7

First ASIL B certification for neural processor IP

Programming Processors In Heterogeneous Architectures

300 mm fab equipment spending to reach $120 billion by 2026

3 Governments Investing in New Fabs Pledge Cooperation

Sensors Converge 2023: 3 trends from the show floor

Global EV Market Almost Reached 11M Units in 2022

A Superconducting Diode To Scale Up Quantum Computers

15-inch MacBook Air teardown reveals... almost nothing

DFRobot Launches UNIHIKER: A User-Friendly Single Board Computer for Learning and Coding

Intel spins out $4.3bn chip mask making business in Europe

AI-Augmented Earbuds That Read Your Mind!

Semiconductor capital equipment market to grow at 8.69% 2023-2032 to reach $ 162 billion by 2032

Intel Labs AI diffusion model generates 3D images from text

Sluggish demand in China prompts Qualcomm, MediaTek to cut wafer starts and prices

In India's Automotive Industry, Connected Vehicle Penetration to Surpass 26% by the End of 2023

JCET starts shipping 4nm chips with Chiplet technology

Samsung and SK Hynix reportedly applied for permanent waiver of US export controls to China

Discover Your Next USB Oscilloscope: The Analog Discovery 3

India Can Manufacture Electronics Worth $225bn And Not $300bn By 2025-26, Claim Some Industry Insiders

Photonic quantum computers can break encryption 700x faster

Samsung brings its self-repair program to the UK

Intel and CEA-Leti to develop 2D TMDs on 300-mm wafers

Modi's visit to US marks more technological investments in India

Foxconn, Stellantis form SiliconAuto for automotive semiconductors