Date: 06/11/2020

3D NAND market to grow 11% CAGR from 2019 to 2025

Market researcher Yole has shared latest market findings on 3-D NAND semiconductor fabrication equipment and manufacturing.

3-D NAND memory market to grow double-digit at a compound annual growth rate of 11% from 2019 to 2025 to reach US$81 billion in 2025.

The top 3D NAND chipmakers are Samsung, WD-Kioxia, SK hynix and Micron-Intel. China based YMTC is growing fast in this area due to local demand. All of this vendors continuously building mega fabs investing billions of dollars, which are fuelling the growth of semiconductor equipment market.

The semiconductor equipment makers who are more into etching and deposition to have more growth opportunities in this market. 3-D NAND semiconductor equipment to grow by 9% CAGR to reach US$17.5 billion by 2025.

ASM Lithography, Applied Materials, Tokyo Electron and Lam Research garner a huge share in this market which is estimated at 70% of total equipment market.

“The 3D-NAND manufacturing equipment market will keep growing, propelled by robust long term NAND-bit demand and ever-increasing manufacturing complexity.” asserts Simone Bertolazzi, PhD, Technology & Market analyst with the Semiconductor & Software division at Yole Développement (Yole).

“3D NAND does not require advanced lithography, but it is highly demanding in terms of deposition and etching, as sophisticated HAR dry etching tools are needed for processing deep and narrow structures in dielectric stacks,” comments Simone Bertolazzi from Yole.

According to Walt Coon from Yole: “The company is currently shipping 64-layer NAND in low volumes domestically, including SSDs, with 128-layer production under development (shipments expected in 2021). YMTC’s 2020 ramp has been hampered by COVID-19, with delays in equipment deliveries/installations at its Wuhan manufacturing site”.