Date: 03/10/2012

IPC looks for papers, course proposals and exhibitors for the 1st ESTC and exhibition

The inaugural IPC Electronic System Technologies Conference (ESTC) is to take place May 20–23, 2013, with an additional exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas. This conference is aimed to keep the momentum of the dramatic revolution in technology and functionality of today’s electronic products and to bring together the entire electronics industry from printed board materials to component packaging and semiconductor design to complete systems.

Tracks for the conference and professional development courses to include: product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fabrication and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.

“The program will include data-driven, high-quality papers, panel discussions, professional development courses and keynote speakers,” says Senol Pekin, Ph.D., Intel Corporation, and general chair of the event. “We have been working hard to establish a well-credentialed program committee of more than 50 experienced technology professionals from across the industry. They will bring excellent technical experience to evaluating the papers and creating a program that has both depth and breadth.”

The exhibition is to bring together companies that supply to all levels of the systems technology supply chain in a 24,000 sq. ft. column-free exhibition hall.

The deadline for abstract and proposal submission is November 5, 2012.

For more information on presenting a paper or teaching a course, visit www.ipc.org/ESTC-CFP.

Source: IPC