Date: 04/07/2012

Korean DRAM fab to use Aixtron deposition equipment for sub-30nm chips

Semiconductor deposition equipment vendor AIXTRON SE said it has received a multi-tool order for its next generation QXP-8300 ALD system from a leading Korean DRAM manufacturer. AIXTRON says the QXP-8300 production system for sub-30 nm DRAM technology nodes will help accelerate high-volume manufacturing of the most advanced DRAM technology node available.

“The AIXTRON QXP-8300 was chosen over other competitive ALD products based on its superior film quality, excellent defect control and best-in-class productivity,” says Dr. Sasangan Ramanathan, Chief Technical Officer at AIXTRON Inc. “This order is a clear indicator of our customers’ confidence in AIXTRON’s technology leadership and superior product performance,” he also adds.

Dr. Bernd Schulte, Executive Vice President and Chief Operating Officer at AIXTRON, comments: “We are very pleased that the leading Korean memory manufacturer has decided to select the QXP-8300 for their advanced DRAM chip manufacturing, and we look forward to supporting their ramp-up in production.”