Date: 07/02/2012

ARM, HP, and SK hynix join Hybrid Memory Cube Consortium

The Hybrid Memory Cube Consortium (HMCC) has announced that new members ARM, HP, and SK hynix, Inc. have joined. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for the innovative new memory technology.

"The strong collection of companies who have joined the consortium — representing a broad range of technology interests — reflects the perceived high value of HMC as the next standard for high-performance memory applications," said Robert Feurle, Micron's vice president for DRAM marketing. "With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics."

Additional information, technical specifications, tools and support for adopting the technology can be found at www.hybridmemorycube.org.