Date: 13/06/2012

TI to showcase its semiconductor innovations at the 2012 VLSI Symposium

Texas Instruments (TI) has announced that several of its technologists are to share research and insight on semiconductor advancements shaping future applications this week at the ongoing 2012 Symposium on VLSI Technology.

"TI's comprehensive research and development activities are addressing some of the electronic industry's most challenging problems," said Ajith Amerasekera, director of TI's Kilby Labs and the 2012 VLSI Symposium Chair. "Several TI speakers at this year's VLSI Symposium will outline how TI is shaping the power, performance and integration of electronics to enable applications we can only imagine today."

The Symposium papers or presentations will address:

1. Issues and challenges in ultra-low power wireless communication
2. CMOS for implementing sub-terahertz (THz) wave systems
3. The impact of through silicon via (TSV) 3D technology on 28-nm CMOS transistor performance

4. Interesting challenges faced by advanced node design enablement teams as Moore's Law scaling takes the industry down to the 14-nm technology node

5. The performance bottleneck in communications systems, data converter power scaling trends and the analog/digital boundary in future serial links and software defined radio applications.