Date: 23/04/0211

Advanced power semiconductor packaging tech display by IR at PCIM 2012 event

International Rectifier (IR) to showcase a new power semiconductor devices for hybrid and electric vehicles (H(EV)) at PCIM (Power Conversion Intelligent Motion) Europe 2012 which is being held at the Nuremberg exhibition center, Nuremberg, Germany, May 8-10, 2012.

IR's new COOLiR silicon and advanced COOLiR2 packaging technology provides a power management platform approach for H(EV) vehicles. This addresses the need to reduce the size, weight and system cost of electric power train components while increasing system reliability for long lifetime, low maintenance and low warranty cost.

"We are pleased to have the opportunity to demonstrate IR's new automotive power platform at PCIM Europe. This new approach combines the most advanced silicon with a unique module concept that allows OEM and major system suppliers to take advantage of outstanding silicon performance in an innovative modular system package that meets industry needs for a scalable, easy to customize yet cost-effective solution at highest power density," said Henning Hauenstein, VP, IR's automotive products business unit.

IR's power management experts will participate in couple of conference events at PCIM.