Date: 14/02/2012

IBM chip fab club to talk on deeper nodes such as 14nm on Mar 14

The semiconductor chip fab tech partners IBM, Samsung Electronics and GLOBALFOUNDRIES are going to preview the future of semiconductor technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.

These companies to address topics covering latest and coming process nodes such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm semiconductor wafer manufacturing.

Registration for the complimentary, one-day event at the Santa Clara Convention Center opens today. To register visit http://www.meetingconsultants.com/CommonPlatform/IBMBLAST

"The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM. The expertise of the companies is driving breakthrough technology innovations for semiconductor manufacturing. Our extensive and open ecosystem, focused on core manufacturing capabilities, gives our customers a flexible way to bring a wide range of semiconductor products to market," said Michael Cadigan, general manager of IBM's microelectronics division.