Date: 13/10/2011

ASSID employs Altatech Semiconductor's 300 mm CVD sys for 3D chip making

All Silicon System Integration Dresden (ASSID) is using single-wafer, multi-chamber AltaCVD 300 system from Altatech Semiconductor S.A. for pilot production of 3D semiconductor ICs. Altatech's 300 mm CVD system is used for depositing conformal dielectric liners inside through silicon vias (TSV) to create advanced 3D ICs and system-in-package (SiP) devices. The TSVs being filled have aspect ratios up to 10:1 and diameters down to 10 microns.

"With Altatech's excellent support, their AltaCVD 300 tool gives us the flexibility to deposit dielectric films with both high-pressure CVD and PECVD, enabling us to integrate the various layers of our 3D devices," said M. Jürgen Wolf, manager of Fraunhofer IZM-ASSID. "We're achieving excellent quality in film conformality, uniformity and integrity at low processing temperatures below 400°C."

"After previously releasing our advanced CVD systems for front-end and memory processing, we are now delivering deposition tools for TSV isolation and conductive layers," said Jean-Luc Delcarri, president of Altatech Semiconductor. "The AltaCVD system's performance in low-temperature processing and its ability to accommodate both 200 mm and 300 mm wafers without changing the hardware within the chamber is generating great market acceptance among both R&D facilities and commercial semiconductor manufacturers."