Date: 13/09/2011

Invensas to demo multi-die, wirebond tech that mounts semiconductor chips upside down

Invensas Corporation to demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) semiconductor device packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.

Invensas says xFD is a novel multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) upside down and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure similar to that of a window-BGA package. With this approach, xFD:
improves capacity and decreases overall component size with a 25 to 35 percent savings in vertical height over conventional solutions
enhances electrical performance with a 50 to 70 percent improvement in speed-bin yield due to symmetric top and bottom die performance
provides a 20 to 30 percent heat transfer advantage over conventional dual-die packages (DDPs)

Invensas xFD technology costs less to manufacture than conventional multi-die DRAM packages because it employs a parallel process flow; significantly reduces gold and other material usage; and is manufactured on existing wirebond assembly lines, according to Invensas.

"We developed the xFD technology platform in response to continued industry demand for denser, faster and cheaper DRAM solutions for servers and mobile devices," said Simon McElrea, president of Invensas Corporation. "xFD provides single-die package performance in a multi-die configuration as well as delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the cost, time and risk of high-volume adoption."