Date: 11/08/2011

Event on Known Good Die (KGD) and 3D semiconductor packaging on Nov 10 2011

MEPTEC organized and SEMI co-sponsored Known Good Die (KDG) conference to address the mounting challenges in semiconductor die product test, assembly, manufacturing and business. This event to be held on Nov 10, 2011 focuses on: "KGD in an Era of Multi-Die Packaging and 3D Integration." The event will be held at the Biltmore Hotel in Santa Clara, California, U.S. This event is co-located with another MEPTEC conference, "2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream," set for November 9.

"Mobile consumer products including tablets and smart phones are driving adoption of multi-function 3D, vertically stacked or multichip packages to meet demanding performance and form factor requirements," states Jonathan Davis, president of the Semiconductor Business Unit at SEMI. "The increasingly complex configurations and packages require high-quality known good die to ensure product functionality and cost performance. We are pleased to support MEPTEC in presenting this important event as the industry addresses the challenges of 3D integration."

The KGD conference sessions will cover such topics as KGD test, handling, delivery, standards, current methods, options and infrastructure. For more information on the Known Good Die conference, visit: http://meptec.org/meptecknowngoodd.html. For more information on the 3D Integration conference visit: http://meptec.org/meptec2.5, 3dbeyo.html. To register for the KGD and/or the 3D Packaging conference, visit: http://meptec.org/meptec2.5d, 3dkno.html.