Date: 10/06/2011

Open-Silicon to tech-support Micron hybrid memory cube technology

Open-Silicon, Inc. and Micron Technology Inc. have announced that the companies have entered into an agreement that will enable them to explore opportunities around Micron's recently announced Hybrid Memory Cube (HMC) products. Micron's HMC technology packs fast logic process technology with advanced DRAM.

"Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology," said Robert Feurle, Micron vice president of DRAM Marketing.

"Micron has developed groundbreaking memory technology that will enable a new level of system performance and integration, as well as new classes of applications that we are only beginning to understand today. We are proud to work with Micron on supporting Hybrid Memory Cube technology, and are excited to know that these solutions will be valuable to the data networking and computing markets that Open-Silicon presently serves," said Naveed Sherwani, president and CEO of Open-Silicon.