Date: 18/01/2011

32/28 nm LP RTL-to-GDSII silicon realization ref flow by Cadence for common platform Alliance

Cadence Design Systems, Inc. introduced a qualified 32/28-nanometer (nm) reference flow for low power high-k (dielectric) metal gate (HKMG) chip making technology developed by alliance of IBM, GLOBALFOUNDRIES, and Samsung which is called Common Platform technology.

Cadence says this new Silicon Realization reference flow for the Common Platform alliance is built around the Cadence end-to-end Encounter flow, including Encounter RTL Compiler, Encounter Test, Encounter Conformal, the Encounter Digital Implementation System, Litho Physical Analyzer, QRC Extractor, Encounter Timing System, and Encounter Power System. It was validated using the 32/28-nanometer ARM low-power physical libraries, and employs the Common Power Format (CPF)-enabled Cadence Low-Power Solution to maintain power intent throughout the design process.

"We worked closely with Cadence to pursue an optimal design flow that enables our mutual customers to create differentiated products in 32/28-nanometer technology," said Gary Patton, vice president, IBM Semiconductor Research and Development Center, on behalf of the Common Platform alliance. "Cadence's Silicon Realization offering of a fully optimized end-to-end design flow targeted to the Common Platform 32/28-nanometer high-k metal gate technology marks our mutual commitment to customer success."

Cadence says the flow encompasses key foundry-validated technologies, including physically aware synthesis, large-scale rapid design exploration and physical prototyping, advanced timing and signal integrity concurrent optimization with multi-mode and multi-corner analysis and optimization, context-aware placement, advanced OCV-aware clock tree synthesis, litho-aware routing, and in-design signoff analysis for timing and power.

"Our close collaboration with the Common Platform partners brings together silicon-proven tools, end-to-end flows and methodologies as an aid to advanced designers looking to achieve better predictability in design convergence, superior quality of silicon and higher design productivity," said Chi-Ping Hsu, senior vice president, Research and Development, Silicon Realization Group at Cadence. "The close collaboration between Cadence and the Common Platform alliance on advanced node, low-power design solutions for Silicon Realization gives designers a fast track to silicon success."