Date: 17/01/2011

Learn latest trends in 28nm HKMG at Common Technology Platform

The Common Platform alliance of IBM, Samsung and GLOBALFOUNDRIES is inviting semiconductor experts to its event to be held on January 18, 2011. This year's event to reveal details of the innovative 28nm HKMG design for low-power applications, along with technology advancements in SoC enablement solutions, semiconductor materials science, process technology and manufacturing.

The event will explore the invention process to bring about next generation technology and the roadmap to 20nm.

Senior executives from ARM, Qualcomm, and Samsung Electronics America will offer their perspectives on the importance of innovation in semiconductor manufacturing to delivering the next generation of mobile devices and consumer electronics.

The below speakers to talk at this forum:

Mike Mueller, Chief Technology Officer, ARM
Steve Mollenkopf, Executive Vice President and Group President, Qualcomm
David Steel, Executive Vice President of Strategic Planning & Corporate Communications, Samsung Electronics America
Gary Patton, Vice President, IBM Semiconductor Research and Development Center
Stephen Woo, President, System LSI Division, Samsung Electronics Co., Ltd.
Chia Song Hwee, Chief Operating Officer, GLOBALFOUNDRIES

During the afternoon session, a variety of technical tracks will be offered on topics ranging from IP-technology co-optimization to 3D integration and advanced device architectures.

For the people who can not physically make it to the event can attend the Virtual Event bringing exclusive web-only sessions and glimpse of the content and excitement of the Common Platform Technology Forum. The online proceedings will stream live from 8:30am - 5:00pm (local timing) on January 18, and you may view the event through April 29, 2011

To learn more visit http://www.commonplatform.com/livestream/default.asp