Date: 20/12/2010

Android supporting 3G smart phone design platform and chip from Broadcom

To stay in line with the market trend of growing influence of Android OS in smart phone and tablet computer domain the convergence focused fables SoC designer Broadcom launched a new baseband platform powered by dual-core ARM processors to provide simultaneous HSDPA modem connectivity and Android-based applications processing. The new Broadcom BCM2157 dual-core baseband processor chip is for high-end smartphone design supporting 3G and Android OS software. The features offered includes mobile hot-spot, multi-touch screens, innovative media and applications processing.

The highlights of this chip and the platform includes:

The new BCM2157 Android baseband platform feature 3G HSDPA modem supports 7.2 Megabits per second (Mbps) downstream connectivity and worldwide roaming.
Built-in support for HVGA displays, multi-touch screens, 5 megapixel digital cameras, 3G dual SIM/dual standby, and other key smartphone capabilities.
Support for mobile hotspot functionality, allowing the handset to share the 3G connections with up to 8 simultaneous devices or users via Wi-Fi.
This chip is now sampling to early access customers with first commercial launches expected in Q1 2011.

Editorial Product Rating: ** (Average Plus)