Date: 22/10/2010

TSMC introduces award for mixed signal /RF design innovatorsTSMC has announced the creation of an annual TSMC Europractice Innovation Award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec. The award recognizes outstanding mixed signal or RF semiconductor design research in Europe and encourages smart silicon adoption. Judging for the TSMC Europractice Innovation Award covers two rounds: a research paper and an oral presentation. In their papers, participants will give a clear explanation of the purpose and relevance of their research and its contribution to the field. In the presentation round, participants who have passed the first stage will orally present their research to the award committee and participate in a discussion with the committee who may provide suggestions for further research. A panel made up of technical experts from imec, TSMC and Global Semiconductor Alliance (GSA) Europe will judge each paper based on its ingenuity, design efficiency, power efficiency and manufacturability based on real silicon results. The prize will be a trip for two design team members to TSMC's Headquarter in Taiwan, where winners will take a tour of one of TSMC's GigaFabs. The award will be announced at GSA's European Forum in May 2011. "We believe that Europe is leading the world in mixed signal and RF silicon design innovation arising from its strong academic and research base. The Europractice Multi- Project Wafer service has long been a channel to unleash that innovation. We expect that the recognition this award provides will encourage European students to demonstrate their flair and innovation," said Maria Marced, President, TSMC Europe.

TSMC has announced the creation of an annual TSMC Europractice Innovation Award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.

The award recognizes outstanding mixed signal or RF semiconductor design research in Europe and encourages smart silicon adoption.

Judging for the TSMC Europractice Innovation Award covers two rounds: a research paper and an oral presentation. In their papers, participants will give a clear explanation of the purpose and relevance of their research and its contribution to the field.

In the presentation round, participants who have passed the first stage will orally present their research to the award committee and participate in a discussion with the committee who may provide suggestions for further research. A panel made up of technical experts from imec, TSMC and Global Semiconductor Alliance (GSA) Europe will judge each paper based on its ingenuity, design efficiency, power efficiency and manufacturability based on real silicon results.

The prize will be a trip for two design team members to TSMC's Headquarter in Taiwan, where winners will take a tour of one of TSMC's GigaFabs. The award will be announced at GSA's European Forum in May 2011.

"We believe that Europe is leading the world in mixed signal and RF silicon design innovation arising from its strong academic and research base. The Europractice Multi- Project Wafer service has long been a channel to unleash that innovation. We expect that the recognition this award provides will encourage European students to demonstrate their flair and innovation," said Maria Marced, President, TSMC Europe.


TSMC has announced the creation of an annual TSMC Europractice Innovation Award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.

The award recognizes outstanding mixed signal or RF semiconductor design research in Europe and encourages smart silicon adoption.

Judging for the TSMC Europractice Innovation Award covers two rounds: a research paper and an oral presentation. In their papers, participants will give a clear explanation of the purpose and relevance of their research and its contribution to the field.

In the presentation round, participants who have passed the first stage will orally present their research to the award committee and participate in a discussion with the committee who may provide suggestions for further research. A panel made up of technical experts from imec, TSMC and Global Semiconductor Alliance (GSA) Europe will judge each paper based on its ingenuity, design efficiency, power efficiency and manufacturability based on real silicon results.

The prize will be a trip for two design team members to TSMC's Headquarter in Taiwan, where winners will take a tour of one of TSMC's GigaFabs. The award will be announced at GSA's European Forum in May 2011.

"We believe that Europe is leading the world in mixed signal and RF silicon design innovation arising from its strong academic and research base. The Europractice Multi- Project Wafer service has long been a channel to unleash that innovation. We expect that the recognition this award provides will encourage European students to demonstrate their flair and innovation," said Maria Marced, President, TSMC Europe.TSMC has announced the creation of an annual TSMC Europractice Innovation Award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.

The award recognizes outstanding mixed signal or RF semiconductor design research in Europe and encourages smart silicon adoption.

Judging for the TSMC Europractice Innovation Award covers two rounds: a research paper and an oral presentation. In their papers, participants will give a clear explanation of the purpose and relevance of their research and its contribution to the field.

In the presentation round, participants who have passed the first stage will orally present their research to the award committee and participate in a discussion with the committee who may provide suggestions for further research. A panel made up of technical experts from imec, TSMC and Global Semiconductor Alliance (GSA) Europe will judge each paper based on its ingenuity, design efficiency, power efficiency and manufacturability based on real silicon results.

The prize will be a trip for two design team members to TSMC's Headquarter in Taiwan, where winners will take a tour of one of TSMC's GigaFabs. The award will be announced at GSA's European Forum in May 2011.

"We believe that Europe is leading the world in mixed signal and RF silicon design innovation arising from its strong academic and research base. The Europractice Multi- Project Wafer service has long been a channel to unleash that innovation. We expect that the recognition this award provides will encourage European students to demonstrate their flair and innovation," said Maria Marced, President, TSMC Europe.