Date: 29/09/2010

Thermal analysis of semiconductor devices by OKI Engineering

OKI Engineering has introduced new range of thermal characteristics analysis services for semiconductor devices. These devices measure the thermal resistance and heat capacity of power devices and optical devices.

OKI says it is important to accurately grasp the thermal characteristics of a new semiconductor device at the design stage. Generally, TEG is used to measure its thermal resistance at the design stage. The TEG method can only measure thermal resistance of an entire semiconductor device and thermal resistance values often deviate between the semiconductor device itself and the device that is assembled in an equipment. Additionally, preparing TEG is time-consuming.

The key features of thermal characteristics analysis services include:
--Thermal characteristics analysis corresponding to package and element compositions.
--Estimates of environmental temperatures based on device power consumption.
--Assessments of optimization based on analysis of various materials and compositions.
--Eliminates the need of TEG, and accelerates evaluations and analysis.
--Allows evaluations of complete products.

"Based on our expertise and experience in reliability test and analysis, we have been providing services that precisely and rapidly evaluate the thermal characteristics of relatively small power semiconductor devices since December 2009," says Yutaka Asai, President of OKI Engineering. "Now, with our expanded thermal characteristics analysis services, we have enhanced the scope and are targeting power devices and optical devices that require large amount of electric power. Deploying a unique measurement method, these services evaluate and analyze thermal characteristics per composite materials of semiconductor devices. This approach eliminates the need of a TEG and allows rapid measurements and flexible response to changes of materials."

The service presents thermal characteristics data visually as graphs. The company will also be able to assess the heat dissipation effects of assembly boards with composite materials, heat-radiation materials, and heat-sinks.

OKI Engineering will exhibit the service at CEATEC Japan 2010 (Booth 6C22 at Makuhari Messe) from October 5 to 9. On October 6, from 14:00 to 15:00, the company will deliver a lecture entitled "Thermal Characteristics Analysis to Enhance the Reliability of Electronic Devices" as part of the series of exhibitors' lectures.