Date: 13/09/2010

Nepes agree to manufacture Freescale's chip package technology

Freescale Semiconductor has signed a licensing agreement with Nepes Corporation, a Korean semiconductor parts and materials specialist, who will manufacture Freescale's redistributed chip packaging (RCP) technology in a lower cost 300mm format.

Nepes installed the 300mm equipment set and manufacturing process capable of multiple layer single-die and multi-die system-in-package solutions at its facility in Singapore (Nepes Pte) earlier this year. The technology start-up at Nepes is in progress with a volume ramp forecast for the first quarter of 2011.

Freescale and Nepes are also collaborating in a joint development of the RCP technology. Development activities are expected to continue at both Freescale's US RCP development facility in Tempe, Arizona and at Nepes' facility in Singapore.

"Working with an outstanding company such as Nepes is a huge step toward introducing the RCP fan-out technology to the market," said Ken Hansen, senior fellow, vice president and chief technology officer at Freescale. "Our joint development collaboration will also allow us to offer our customers compelling solutions for single die, 2D and 3D systems-in-package targeted at a broad range of industries and applications."

"We are glad to work with Freescale, one of the leading companies in the semiconductor industry," said Esdy Baek, senior vice president and chief of the global business center at Nepes. "Through licensing and the ongoing joint development of RCP, Nepes Corporation will be able to provide leading edge packaging solutions to the market. With RCP technology support from both South Korea and Singapore, Nepes is in a strong position to support our customers and the market."

Freescale says RCP integrates semiconductor packaging as a functional part of the die and system solution. This technology eliminates higher cost wire bonds, package substrates and flip-chip bumps. This 4-year-old packaging tech eliminates blind vias and achieves thin profiles.

RCP is touted as alternative to current wire bond BGA and flip chip BGA. RCP supports present day semiconductor chip manufacturing process using low-k interlayer dielectric materials. RCP technology is halogen and lead-free in compliance with RoHS.