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  Date: 10/09/2010

SEMI: Worldwide Semiconductor equipment billings reach $9.11billion in Q2' 2010

SEMI and Semiconductor Equipment Association of Japan (SEAJ) have gathered data from over 100 global equipment companies that provide data on a monthly basis. SEMI has reported on the basis of this data that the worldwide semiconductor manufacturing equipment billings has reached $9.11 billion in Q2' 2010.

It has also been reported that the worldwide semiconductor equipment bookings were US$11.68 billion in the second quarter of 2010, which is 296 % more than the equipment bookings in Q2' 2010 and 24% greater than the bookings figure in Q1' 2010.

The quarterly billings data by region in millions of U.S. dollars, year-over-year and quarter-over-quarter growth rates by region are as follows:




Region


2Q 2010


1Q 2010


2Q 2009

2Q10/1Q10
(Q-o-Q)

2Q10/2Q09
(Y-o-Y)

Taiwan

2.58

2.24

0.74

15%

247%

Korea

2.17

1.90

0.40

14%

445%

North America

1.23

0.90

0.69

36%

78%

Japan

1.01

0.87

0.33

16%

202%

ROW

0.85

0.81

0.22

4%

279%

China

0.72

0.42

0.11

70%

533%

Europe

0.55

0.31

0.17

76%

213%

Total

9.11

7.46

2.68

22%

240%


Earlier to this release SEMI had reported in its latest World Fab Forecast report, there will be 133% increase equipment spending for front-end semiconductor fabs in 2010 followed by a further 18% increase in 2011. According to the data in this report for 2010 and 2011 SEMI has also suggested that over 150 semiconductor fab projects could contribute an estimate $83 billion in spending. These figures from SEMI further indicate that the worldwide semiconductor equipment spending is on the rise.

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