Date: 06/07/2010

SEMI releases 8 new technical standards

SEMI has announced eight new technical standards applicable to the semiconductor, MEMS, FPD and photovoltaic (PV) manufacturing industry. The new standards have been developed by technical experts from various equipment and material suppliers. These standards is a part of the July 2010 publication cycle and join more than 790 standards that have been published by SEMI during the past 36 years.

"Today's release of these eight new SEMI International Standards covers a wide range of applications, including display, PV, and 450 mm wafers," said James Amano, Director, SEMI International Standards. "These standards address issues that are active today, and those that will arise when and if the industry moves to larger-diameter silicon."

The new SEMI Standards released are:

1. SEMI T20.3: Specification for Service Communication for Authentication of Semiconductors and Related Products.
2. SEMI E158: Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling.
3. SEMI M76: Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers.
4. SEMI D60: Test Method of Surface Scratch Resistance for FPD Polarizing Film and Its Materials.
5. SEMI E156: Mechanical Specification for 450 mm AMHS Stocker to Transport Interface.
6. SEMI E157: Specification for Module Process Tracking.
7. SEMI D59: 3D Display Terminology.
8. SEMI PV4: Specification for Range of 5th Generation Substrate Sizes for Thin Film Photovoltaic Applications.

For more information visit: www.semi.org