Date: 21/11/2009

Semiconductor packaging materials market to reach $20.1 billion by 2013

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.8 billion in 2009 and grow to $20.1 billion by 2013, according to a new study by SEMI and TechSearch International. Laminate substrates remain the largest segment of the market, worth an estimated $6.8 billion globally in 2009, and on a unit basis are projected to grow at a compound annual growth rate of eight percent over the next five years.

The report, titled "Global Semiconductor Packaging Materials Outlook- 2009/2010 Edition", covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials. The packaging materials market is in the midst of significant changes as new materials have been introduced and as the industry finds it difficult to identify new material solutions for 32 nm and below silicon technology generations.

Semiconductor Packaging Materials estimate of 2009

Laminate Substrates
$6,834.0 million

Flex Circuit/Tape Substrates
$132.0 million

Leadframes
$2,586.0 million

Bonding Wire
$3,838.2 million

Mold Compounds
$1,016.0 million

Underfill Materials
$150.0 million

Liquid Encapsulants
$117.3 million

Die Attach Materials
$582.5 million

Solder Balls
$157.7 million

Wafer Level Package Dielectrics
$21.7 million

Thermal Interface Materials
$338.1 million

For more details visit www.semi.org