Date: 19/09/2009

UMC audits carbon footprint for its IC wafer production facility

UMC has completed the foundry industry's first reported carbon footprint verification for integrated circuit wafers produced at its facilities. UMC conducted carbon footprint inventory on its 200mm wafers at the company's Fab 8A according to international carbon footprint standard PAS2050, with the results receiving third party verification by Det Norske Veritas (DNV).

Mr. Muh Liang Liao, vice president from UMC, said, "UMC has always paid special attention to the issue of climate change and has aggressively implemented comprehensive carbon management programs. Due to the advanced technologies and numerous materials involved in the manufacturing of semiconductor wafers, carbon footprint calculation is quite complicated. Since UMC started its product life cycle assessment in all fabs in 2005, we were able to complete this verification in the shortest time possible. The result is a significant milestone for UMC's development in green production. This verification provides complete, scientific and reliable disclosure on the carbon information of products manufactured in our fabs as well as self-review on environmental impact. Moreover, it is a demonstration of UMC's social responsibility to practice transparent communication with our stakeholders."