Date: 25/06/2009

SEMI accepting papers for the SEMICON Europa, a semiconductor equipment event

SEMI has announced that abstracts for paper presentations in the field of semiconductor and MEMS manufacturing are now being accepted for SEMICON Europa, which will be held 6-8 October 2009 in Dresden, Germany.

Submitted papers should focus on papers that describe practical and successful solutions/examples on how to cost-efficiently maintain control over device functionality, reliability and productivity feed-back loop in the challenged IC/ Microsystems technology (MST) markets.

The main topics covering semiconductor fab technologies, testing, packaging, MEMS and the new materials are:
1. Increasing EU Fab Performance (Test Development Robustness & Industrialization, Fab Yields Improvement Through Test Data)
2. New Test Challenges (MEMS / Healthcare / High Reliability Devices, New Environments / New Challenges / New Requirements, Balancing costs vs high quality and performance requirements)
3. Achieving low cost high speed interface linked to DFT (Design for Test)
4. Collaborative Development & Funding
5. Tool Life-Cycle Management
6. Agility and Productivity
7. Energy conservation
8. Pushing Lithography limits
9. Advanced Packaging Market
10. System Integration Technologies/ More than Moore
11. New MEMS applications (Emerging applications which are driving new MEMS technologies)
12. Manufacturing Strategies and Challenges (Viable production concepts for MEMS products)
13. MEMS Technologies Process (New materials and processes for MEMS, front-end, back-end and testing )
14. MEMS Market Review
15. New Materials providing for New Technologies
For complete details go to: http://www.semiconeuropa.org/ProgramsandEvents