Date: 31/10/2006

NXP's new family of smartcard ICs are thinner than a sheet of paper.

NXP has announced new family of smartcard ICs called SmartMX family, which are only 75 micrometers in thickness. This new record is 50% thinner than the present smartcard ICs.
These chips are developed for e-passport/Visa and such key ID card applications. The thinness helps in to add additional layers of security information and protective layer on smartcards.
This development is in the direction towards ultra thin smartcards and various innovative security and identity applications.

NXP, ST Micro, and Infineon (all Europe based companies) leading the development; in this market of security and identification.