Date: 28/03/2007

Infineon's 130nm process technology for HSMC fab in India

Hindustan Semiconductor Manufacturing Corp. (HSMC), a new firm founded by US based Non Resident Indians (NRIs) is building a semiconductor fabrication (fab) facility in India to manufacture System On Chip (SOC) type of semiconductor ICs for cellphone, RF ID, Automotive applications. HSMC is getting 130 nm process technology license from Infineon Technologies for this new venture.

Apart from 130 nm process technologies licensing, Infineon will also provide expertise and advise in setting up this new fab, and license its qualified silicon design libraries. The domestic Indian market for mobile phones, smart cards and automotive applications are expected to be big and growing fast. Infineon's special strengths in these areas make it a right partner for HSMC.

HSMC plans to build both 8-inch and 12-inch wafer fabs separately. 8-inch fab with an investment of 1 billion USD is expected to churn out ICs in two years from now. The 12- Inch fab is to follow next with investment of USD3.2 Billion to USD3.5 Billion USD.