Date: 12/03/2025

OCP and JEDEC jointly made available new Chiplet Design Kits for use with today's EDA tools

Open Compute Project Foundation (OCP) and JEDEC Solid State Technology Association announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, Material and Test developed in collaboration within the OCP Open Chiplet Economy Project. Leveraging the alliance between OCP and JEDEC, these design kits are now part of the Global World Wide Standard JEDEC JEP30: Part Model Guidelines.

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