Date: 27/04/2025
Mitsubishi introduces Full-SiC and Hybrid-SiC SLIMDIP modules for enhanced energy efficiency in home appliances
Mitsubishi Electric announced that it will begin shipping samples of two new SLIMDIP series power semiconductor modules for room air conditioners and other home appliances, the Full SiC SLIMDIP (PSF15SG1G6) and the Hybrid SiC SLIMDIP (PSH15SG1G6), on April 22. Both modules, the first SiC versions in the company's SLIMDIP series of compact, terminal-optimized modules, achieve excellent output and power loss reduction for energy savings in small- to large-capacity appliances. They will be exhibited at Power Conversion Intelligent Motion Expo & Conference 2025 in Nuremberg, Germany from May 6 to 8, as well as trade shows in Japan, China, and other countries.
Mitsubishi Electric's newly developed silicon carbide metal-oxide-semiconductor field-effect transistor chip is incorporated into both new SLIMDIP packages. Compared to current silicon -based reverse-conducting insulated-gate bipolar transistor SLIMDIP modules, these new SiC modules achieve higher output for larger-capacity appliances.
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