Date: 27/10/2023

Photorelay in a small thin WSON4 package for semiconductor testers

Toshiba launches small photorelay in a small, thin WSON4 package for high-frequency signal switches in semiconductor testers.

It reduces insertion loss and suppresses power attenuation in high-frequency signals [1] and is suitable for the pin electronics of semiconductor testers, which use a large number of relays and require high-speed signaling. Volume shipments start today.

Toshiba’s optimized package designs reduces parasitic capacitance and inductance in the new photorelay. This reduces insertion loss and improves the transmission characteristic of high-frequency signals to 20GHz (typ.) [2], about 1.5 times lower [2] than Toshiba’s current product, TLP3475S.

TLP3475W uses a small, thin WSON4 package that is only 0.8mm (typ.) thick, making it the smallest [3] photorelay in the industry to realize improved high-frequency signal transmission characteristics. It is 40% lower in height than Toshiba’s ultra-small S-VSON4T package, allowing more products to be mounted on the same circuit board, and will contribute to improved measuring efficiency.

Toshiba said it will continue to expand its product line-up to support semiconductor testers that deliver higher speeds and greater functionality.




Applications:

Semiconductor testers (high-speed memory testers, high-speed logic testers, etc.)
Probe cards
Measuring equipment

Features:

Industry’s smallest WSON4 package: 1.45mm×2.0mm (typ.), t=0.8mm (typ.)
Improving to pass the high-frequency signals: f=20GHz (typ.) @Insertion loss(S21) = -3dB
Normally open function (1-Form-A)





For more info visit:
https://toshiba.semicon-storage.com/info/lookup.jsp?pid=TLP3475W

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