Date: 19/11/2012
Advantest introduces electron microscope for use in 14nm to 22m node process
Semiconductor manufacturing instrumnet supplier Advantest Corporation has introduced its new Multi-Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology.
Built on advances in the technology used in Advantest’s E3630 MVM-SEM for photomasks, the E3310 achieves superior capabilities for scanning and measurement of wafers for next-generation devices. It is a stable, high-accuracy measurement solution for process development at the 1Xnm node and mass production at the 22nm node and beyond, contributing to reduced process TAT (turn around time) and higher productivity. The E3310 will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.
WAFER MVM-SEM E3310
A Next-Generation 3D Measurement Solution
While advances in semiconductor technology have historically followed Moore’s Law, technical challenges have recently imperiled the transition to yet-smaller processes. The development of 3D transistor technologies such as FINFET (fin-based field effect transistors) is expected to bridge the gap to mass production at the 22nm node and subsequently the 1Xnm node. Advantest’s new E3310 provides a stable, highly accurate 3D measurement solution suitable for these next-generation needs.
Product Features
3D Measurement
The E3310’s multi-detector configuration allows it to achieve stable, highly accurate measurements at the 1Xnm node. It also features a proprietary detection algorithm, enabling measurement of the 3D FinFET architectures that are in the process of full-scale adoption by the semiconductor industry.
Highly Stable, Fully Automatic Image Capture
The E3310 performs stable, fully automatic measurements even at high SEM magnification, thanks to its high-accuracy stage, charge control function, and contamination reduction technology.
Support for Diverse Wafer Types
Not only silicon wafers, but AlTiC, quartz, and silicon carbide wafers, among others, are supported in sizes from 150mm to 300mm, depends on type.
Advantest Corporation has also announced that it has developed a new mask defect review tool, the Mask DR-SEM E5610, for reviewing and classifying ultra-small defects in photomask blanks.
The E5610 inherits the highly stable, fully automatic image capture technology developed by Advantest for its acclaimed multi vision metrology SEM for photomasks, and features a newly developed beam tilt mechanism that enables scanning at oblique angles. With its high-accuracy, high-throughput defect review capability, the E5610 is expected to contribute to next-generation photomask product quality improvement and shorter manufacturing TAT (turn-around times).
The E5610 will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.
MASK DR-SEM E5610
A Next-Generation Photomask Manufacturing Solution
Photomask manufacturing processes require 100% eradication of fatal defects, which adversely affect yield, in tandem with TAT reduction. Advantest’s new E5610 promises to be an indispensable solution for mask manufacturers, satisfying both of these requirements with fast, accurate technology that classifies defects and diagnoses appropriate repair solutions with regard to type.
Product Features
High Spatial Resolution & Oblique Scanning Capability
Advantest’s proprietary column architecture delivers spatial resolution down to 2nm, even at the low acceleration voltages appropriate for photomask screening. Moreover, the E5610 features a unique, electrically controlled tilt module that allows its beam to tilt by up to 15°, enabling users to perform 3D defect reviews.
Highly Stable, Fully Automatic Image Capture
Even when operating at high SEM magnification, the E5610 performs stable, fully automatic defect imaging at a high rate of throughput, thanks to its high-accuracy stage, charge control function, and contamination reduction technology.
Compatible With Mask Inspection Systems
The E5610 is compatible with mainstream mask inspection systems: the tool imports defect location data and automatically images the locations. It supports the industry standard KLARF (KLA Results File) format.
Elemental Composition Analysis Option
The E5610 features an optional EDS (energy dispersive X-ray spectrometry) module that performs elemental analysis—an advanced method of mapping mask blank defects.
News Source: Advantest