Date: 03/10/2012

TDK introduces thin-film metal power inductors in 4 case sizes including IEC 1608

TDK Corporation has developed four new series of miniature, low-profile thin-film metal power inductors featuring up to twice the rated current and half the DC resistance of comparable ferrite inductors. The new TFM family is available in four form factors that include IEC 1608 (1.6 x 0.8 x 1.0 mm3) which is the world’s smallest metal power inductor as claimed by TDK. The other case sizes are 2520, 2016 and 2012.

The TFM thin-film metal power inductors are suitable for use in the DC-DC converters that serve as power supplies in smartphones, tablet PCs and mobile devices.

Features:
1. Inductance: 0.47 µH to 2.2 µH
2. Rated current: 0.8 A to 4.0 A
3. Metal magnetic core material supports higher rated currents.
4. Thin-film technology achieves low DC resistance in miniature, low-profile package.

While the core material of inductors is predominantly ferrite, TDK has harnessed its proprietary materials technology to create a magnetic metal with high saturation flux density, enabling excellent electrical properties in a very compact component. Compared to the previous ferrite type (TFC252010/2.2µH), for example, the rated current has been doubled without sacrificing extremely stable DC superposition characteristics. TDK's cutting-edge thin-film technology allows the creation of a high-precision coil pattern in the wafer process. Combined with advanced plating technology, this results in reduced DC resistance, thus cutting losses. In smartphones, for example, with their multiple power supply inductors, the use of the new TDK TFM thin-film metal power inductors contribute towards improved power supply efficiency and longer battery life.

Mass production began in September 2012.

Source: TDK