Date: 06/09/2012

Reticle monitoring sys for 20nm and below semiconductor fabs

Semiconductor manufacturing equipment vendor KLA-Tencor has unveiled two new reticle inspection systems called X5.2 and Teron 611 for advanced semiconductor fabs making chips in the nodes of 28nm and below. The new X5.2 applies its high performance to capture defects and pattern degradation on photo-masks currently in production (with the capability to support up to 20nm node chip fabrication). The Teron 611 is designed for inspecting photo-masks used at 20nm node and lower.

"New cleaning processes and smaller pattern features on the mask have altered the landscape for reticle monitoring in the fab," said Yalin Xiong, Ph.D., general manager of the Reticle Products Division at KLA-Tencor. "Primary and assist pattern features are not only smaller at the 20nm node, but the distinction between them is becoming blurred—making it more difficult to determine whether a defect will affect the pattern on the wafer. Our customers are also increasingly concerned with the effect of mask pattern degradation on the process window—a result of repeated cleaning and exposure. We have designed the X5.2 and Teron 611 inspection systems to comprise a Total ReQual solution, monitoring defectivity and pattern degradation down to the 20nm node and beyond."

The other capabilities of the X5.2 and Teron 611 tools include:
Fifth-generation STARlight inspection mode for full area coverage on multi- and single-die reticles; preferential defect capture on edges and sidewalls of pattern; and dependable capture of defects in open areas;
Advanced algorithms providing reliable discrimination between nuisance events and defects of interest (DOI);
Highly flexible architecture allowing adjustment of sensitivity and speed to address a fab's changing product mix, product life cycle and yield status;
Optional configuration providing industry-leading throughput for advanced design nodes (X5.2); and
Unique connectivity to KLA-Tencor's e-beam defect review platform, the eDR-7000, enhancing speed and accuracy of on-wafer defect population profiling.

KLA-Tencor said it has shipped X5.2 and Teron 611 systems to leading chip manufacturers in the United States and Asia, where they are being used in 28nm production and 20nm pilot lines.