Date: 16/07/2012

6 axis compact MEMS module embeds motion recognition intelligence

STMicroelectronics has unveiled new 6-axis MEMS motion sensor device with custom motion-recognition capabilities. ST’s latest iNEMO inertial module serves range of motion sensing applications including mobile phones, gaming devices, any such mobile hand-helds, and wearable sensor applications in sports, fitness and healthcare diagnostics.

6 axis mems module

The LSM330 module packs both 3-axis digital gyroscope and a 3-axis digital accelerometer with two embedded finite state machines – programmable blocks that enable custom motion recognition inside the module, that’s the embedded motion recognition intelligence. Programmable state machines enable the identification of specific motions or gestures and initiate associated actions or applications, such as switching on an augmented-reality view of a near-by object by moving your phone with a specific gesture. Integrated processing capability in MEMS sensors helps decrease power consumption in battery-hungry portable devices and brings more freedom and flexibility to the design of motion-enabled consumer electronics, as per ST.

This latest module detects acceleration up to 16g and angular rate up to 2,000 dps along the pitch, roll and yaw axes 2. With both linear and angular motion sensing in a single device offers a compact design solution for space constrained devices. Few examples suggested by ST for this device LSM330 multi-sensor module includes wearable sensor applications, motion-activated user interfaces in phones and tablets; motion detection and map-matching for indoor/outdoor navigation, augmented reality and other location-based services.

The module works in both power-down and sleep modes and an embedded FIFO (first-in first-out) memory block for smarter power management. It can operate with any supply voltage over the range of 2.4 to 3.6 Volts.

It is fully software-compatible with ST’s other MEMS devices such as 3-axis digital accelerometers (LIS3DSH) and gyroscopes (L3GD20), the new iNEMO module helping designers to upgrade easily.

Packed in a 3x3.5x1mm LGA package, the LSM330 6-degrees-of-freedom module will start sampling by the end of Q4 2012 Unit pricing is $4.15 for volumes in the range of 1,000 pieces.

More info at www.st.com