Date: 15/07/2012

Canon launches litho tool DUV scanner for chip manufacturing

Canon U.S.A. said it has commenced sales of the new FPA-6300ES6a Deep Ultra-Violet (DUV) scanner, a lithography tool employing a KrF excimer laser light source.

The new FPA-6300ES6a, designed for the mass production of Dynamic Random Access Memory (DRAM), flash and other memory devices; logic devices such as microprocessors for personal computers; color filters and other imaging sensors and image-processing devices.

Based on technologies cultivated through the field-proven FPA-6000 series, Canon's new FPA-6300ES6a DUV scanner achieves high throughput and high-overlay accuracy to effectively respond to the advanced needs of chip manufacturers seeking reduced cost of ownership.
High-Productivity Scanner: Throughput = 200 wafers per hour.

Canon says the new Canon DUV scanner incorporates a newly designed Reticle Stage and Wafer Stage that achieve accelerated exposure processes, significantly reducing necessary exposure times. By optimizing the wafer alignment sequence and reducing the time of wafer handling and other processes, the FPA-6300ES6a model realizes a high throughput rate of more than 200 wafers per hour, an approximately 60 percent improvement over its predecessor.
High-Accuracy Scanner: Overlay = 5nm.