Date: 24/06/2012

Flexible thermally conductive epoxy from Master Bond withstands 500 Deg F

Master Bond has announced flexible, heat resistant epoxy EP36AO that combines thermal conductivity with thermal stability. This epoxy has superior mechanical properties and is formulated for electrical potting and encapsulation applications.

Specifications of EP36AO:
1. Temperature range: -80°F to +500°F
2. Dielectric strength: 400 volts/mil
3. Volume resistivity: 2-3 x 1012 ohm-cm
4. Thermal conductivity: 9-10 BTU·in/ft2·hr·°F at 25°C
5. Coefficient of thermal expansion: 75 in/in x 10-6/°C at 60°C
6. Tensile strength: 2,000 psi
7. Typical gel time is 30 minutes at 180°F, with full cures attained in 2-2½ hours at 300°F
8. Retain its liquidity for temperatures below 180°F

EP36AO is an adhesive and coating that remains well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.

The material doesn't require any mixing and provides the convenience of flexible cure schedules as a one component system. It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container.

EP36AO is available in pints, quarts, gallons and five gallon containers. It is also available in conveniently prepared 30 gram cookies.

Information on thermally conductive epoxies: http://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives