Date: 21/06/2012

ADLINK’s COM Express module powered by Intel Core i7 for air-borne and mil apps

ADLINK Technology, Inc has announced the release of its latest Ampro by ADLINK Extreme Rugged COM Express module, the Express-IBR for airborne and vehicle-mounted military computers and human machine interfaces (HMI) applications required to function in harsh environments. The Ampro by ADLINK Express-IBR is a COM Express Type 6 module that supports the quad-core and dual-core 3rd generation Intel Core i7 processors and Mobile Intel QM77 Express chipset. The Express-IBR is suitable for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges.

Features of Express-IBR:
1. Quad- or dual-core 3rd generation Intel Core processor
2. Supports USB SuperSpeed 3.0, PCI Express (PCIe) Gen 3, and up to three independent displays
3. Up to 16GB ECC 1333MHz DDR3 memory in two SODIMM sockets
4. Three digital display interfaces can be independently configured for DisplayPort, HDMI or DVI
5. PCIe x16 (Gen3) for external graphics or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4)
6. Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, and eight USB 2.0 interfaces
7. Extended temperatures ranging from 40°C to +85°C
8. 50% thicker printed circuit board (PCB) for high vibration tolerance
9. Compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout

"ADLINK's Express-IBR is equipped with the 3rd generation Intel Core processor, which utilizes Intel's new 3D tri-gate transistor technology and 22nm process technology," said Jeff Munch, CTO of ADLINK Technology and chair of the COM Express COM.0 R2.1 Sub-committee. "This platform delivers higher performance per watt over previous-generation processors - a feature that is critical for rugged applications requiring high performance in high temperature environments."

"The 3rd generation Intel Core processor-based platform delivers best-in-class performance and reliability for ruggedized applications," said Matt Langman, director of marketing, Intel Intelligent Systems Group. "The new platform offers continued support for ECC on select processor SKUs to ensure data integrity, and the introduction of next generation I/O - such as integrated PCI Express Gen 3.0 and USB 3.0?oenables processing of a significant amount of data over the 2nd generation Intel Core processor family at lower or same thermal footprint."