Date: 20/06/2012

3.3 x 3.3 mm power MOSFETs from NXP in LFPAK33 operate in extreme conditions

NXP Semiconductors N.V. has released its new LFPAK33 portfolio – a range of high switching performance MOSFETs available in an ultra-reliable 3.3 x 3.3 mm power package. The LFPAK33 package has been designed from the ground up to be a tough power solution. The package incorporates copper clip, solder die attach technologies and features a junction temperature of 175 degrees Celsius. Nine LFPAK33 power MOSFET types are available immediately.

Components need to shrink to fit the available space as the electronic devices become smaller and MOSFETs are expected to work under extreme thermal and mechanical conditions.
As the device expands at a different rate to the PCB, continuously switching many tens of amps at high temperatures can cause solder joint failure or crack the package case. LFPAK33 minimizes the risk of this type of damage through its construction which allows the exposed SOURCE and GATE pins to “flex” and safely absorb thermally- and mechanically-induced stresses.

“The never-ending trend to miniaturization in power switching applications is driving the need for MOSFET packages that can reliably handle system power requirements while minimizing the PCB space required,” said Dr. Dilder Chowdhury, product marketing manager, standard MOSFETs, NXP Semiconductors. “LFPAK33 builds on the success of NXP’s LFPAK56 package, with comparable performance in an even smaller footprint. These packages have been designed for reliability, with best-in-class thermal performance. There’s no other solution available that delivers this degree of robustness and power in such a small package.”

LFPAK33 is fully compatible with QFN and DFN3333 packages in terms of PCB footprint and automated vision inspection. The PCB footprint has been fully tested for compatibility by Norcott Technologies.

Features:
1. Unique rugged construction, specifically designed for space-constrained power applications
2. No wire bonds, best-in-class thermal performance, up to 175°C
3. Resilient to mechanical and thermal stresses
4. Exposed leads means improved optical inspection of solder joints
5. 0.85-mm package height
6. Footprint compatible with QFN3333 / DFN3333
7. Proven track record from LFPAK56 – “The Toughest Power SO-8”
8. NextPower SuperJunction MOSFET technology

LFPAK33 power MOSFET portfolio: http://www.nxp.com/lfpak33