Date: 18/06/2012

World’s first 2 x 2 mm MOSFETs with tin-plated solderable side pads from NXP

NXP Semiconductors has introduced 30V N-channel MOSFETs ‘PMPB11EN and PMPB20EN’ in a 2 x 2 mm low-profile DFN (discrete flat no-leads) package with tin-plated, solderable side pads. These side pads have the advantage of optical soldering inspection and better solder connection quality compared to conventional leadless packages.

Features of PMPB11EN and PMPB20EN:
1. VGS: 20V
2. Package: DFN2020MD-6 (SOT1220)
3. Maximum drain current (ID): >10 A
4. Rds(on) values: 12 mOhm typ and 16.5 mOhm typ at 10V respectively
5. Height: 0.6 mm

These MOSFETs are suitable for ultra-small load switches, power converters, and charger switches in portable applications such as smartphones and tablets. The devices are also suitable for space-constrained applications such as DC motors, server and network communications and LED lighting.

DFN2020 packages are eight times smaller than the standard SO8 packages and they offer comparable thermal resistance. They can replace many larger MOSFET packages such as SO8, 3x3 or TSSOP8 with the same Rds(on) value range.

These devices are available immediately.

For more information:
PMPB11EN: http://www.nxp.com/pip/PMPB11EN
PMPB20EN: http://www.nxp.com/pip/PMPB20EN