Date: 13/05/2012

Panasonic's new PCB reduces thickness by 30%, weight by 35%, and the via dia by 25%

Panasonic Corporation has developed mass production technology for its ALIVH-F (Any Layer Interstitial Via Hole) resin circuit boards which use polyimide film for their substrate.

Panasonic says by reducing thickness by approximately 30%, weight by 35%, and the inter-layer via hole diameter by 25%, it has been possible to increase the circuit density of the board. Sample shipments of the newly developed ALIVH-F are scheduled to start in June 2012, with mass-production planned for December 2012.

ALIVH-F supports higher density component packaging for mobile devices such as smartphones and tablet terminals. In some applications, the reduced board area and thickness may be utilized to increase battery capacity.

The newly developed ALIVH-F has the following features. (Comparison with the company's previous ALIVH-G product).

The any-layer IVH structure employing the same glass-epoxy board material as ALIVH, allows the high density packaging of components to be achieved.

A reduction in thickness and weight of the circuit board of approximately 30% and 35% respectively enables lightweight, high-functionality mobile terminals with a thin profile to be designed.

Reducing the inter-layer via-hole diameter by approximately 25% and the width and pitch of wiring patterns by approximately 40% enables high-density packaging.

The newly developed ALIVH-F was made possible by the following technologies.

Material property control technology for reliably filling the newly developed conductive paste in the small-diameter via-holes of 100 µm or less.

Alignment lamination technology for enabling high-accuracy film lamination.

High-accuracy fine-pattern forming technology

The ALIVH-F to be exhibited at the JPCA Show to be held in Tokyo Big Site on June 13 to 15, 2012.