Date: 03/05/2012

Process and metrology tool set from CEA-Leti for wide range of device makers

Semiconductor technology researcher CEA-Leti has announced a focus on a new collaboration mode for a wide range of industry oriented customers from start-ups to manufacturers. The research oriented unique CEA-Leti's process and metrology tool set offers:

1. Advanced single step processes to high end process modules to realize some or the entire product or simply make a proof-of-concept demonstration.
2. Flexible customer owned processes to meet small manufacturing requirements, through prototyping or small pre-series before transfer to commercial foundries.
3. Equipment access through the expertise of CEA-Leti engineers.

LETI-3S for silicon specialty solutions is targeting start-ups, component integrators, fabless or fablite companies, equipment or consumable suppliers. Other entities concerned are foundries or research centers with a limited processes offer, micro and nanotechnologies companies who don't want low volume activities, and high value silicon wafers dealers.

The main domains that 3S addresses are:
1. Deposition
2. Front side/back side cleanings, wet etch and stripping
3. Lithography with dual side alignment capability. LETI-3S can provide generic masks but usually works on customer designs adapted to CEA-Leti lithography tools.
4. Etching
5. Implantation, epitaxy, diffusion
6. CMP, bonding, grinding, dicing
7. Advanced in-line metrology

LETI-3S is operated on the Minatec campus in Grenoble on 24/7 200mm and 300mm technological platforms. Lower wafer sizes should be available. LETI-3S can provide substrates or work on customers wafers, pre-processed or not, through stringent contamination protocols.
LETI-3S ensures a full traceability from process flow conception to products delivery. SPC, FMEA, audits or conformance certificates to specifications are available according to the type of inquiry.
Website: http://www.leti.fr/en/How-to-collaborate/Collaborating-with-Leti/Leti-3S