Date: 29/04/2012

SOT1226 package with 0.5 mm pad pitch, the world's smallest logic package revealed by NXP

NXP Semiconductors has announced the new SOT1226 "Diamond" package featuring a unique pad pitch design. NXP says this package is the world's smallest general purpose logic package. This SOT1226 package is a 5 pin leadless plastic that measures 0.8 x 0.8 x 0.35 mm.

As compared to the earlier package SOT1115, this package is 25% smaller. The SOT1226 offers a 0.5 mm pad pitch that is 50% larger for easier soldering. This package enables device miniaturization and suits for portable devices such as smartphones, mobiles, etc.,

A step-down mask is not required during the soldering process because of this package's larget 0.5 mm pad pitch.

"Mobile designers are constantly faced with the challenge of adding more functionality and features into portable devices while using less space, which in turn introduces new challenges," said Kristopher Keuser, director of marketing, logic business line, NXP Semiconductors. "NXP's new Diamond package is a game-changing solution that allows our customers to design within smaller geometries without increasing manufacturing costs, and to standardize their entire product portfolio. It underscores our commitment to leadership, innovation and understanding of a market that is driven by the need for smaller, cheaper and more reliable solutions."

Samples of logic devices in SOT1226 are already shipping to customers.