Date: 21/02/2012

Mindspeed's new SoC incorporate Picochip's tech

Mindspeed has announced that its most advanced system-on-chip (SoC) solution for dual-mode concurrent 3G and long-term evolution (LTE) operation incorporating widely deployed 3G technology from Picochip is sampling now.

The Transcede family of processors are complete NodeB and eNodeB SoC solutions that support concurrent 3G and LTE processing in a single device, including time division synchronous code division multiple access (TD-SCDMA), wideband code division multiple access (WCDMA)/ evolved high speed packet access (HSPA+) and both frequency division duplexing LTE (FDD-LTE) and time division duplexing LTE (TDD-LTE), with a roadmap to LTE-Advanced (LTE-A). The Transcede T22xx series comes in product variants targeting residential, small office/home office (SOHO) and small enterprise applications. Multiple T33xx series options are available for enterprise, metro and pico applications.

"We are moving quickly to combine Mindspeed's and Picochip's expertise and portfolios into an offering that is uniquely positioned to help carriers address the challenge of relentlessly growing data demand," said Raouf Y. Halim, chief executive officer of Mindspeed. "Our new dual-mode solutions will enable operators to support both 3G and LTE in a single unit, dramatically improving their business case by delivering twice the benefit at half the traditional per-node opex and capex costs. The Transcede devices will also enable operators to improve existing 3G network quality, while providing more capacity for their subscriber base without the need for additional investments."


"We expect that shipments of semiconductors for femtocells and picocells will grow tenfold by 2017," said Joe Madden, Principal Analyst at Mobile Experts. "Small cells are critical for supporting future mobile data demand, and dual-mode functionality will be essential for the best use of limited spectrum. Mindspeed leads the market in LTE design engagements with its Transcede family, and the addition of Picochip's 3G technology to this platform creates an extremely attractive proposition for OEMs developing multi-mode small cells."

Availability: The Transcede T22xx and T33xx series products are available now in sample quantities, with volume production scheduled to begin in the fourth calendar quarter of 2012. They are packaged in 21x21mm and 31x31mm high-performance flip-chip ball grid array (HFC-BGA).