Date: 05/02/2012

Schottky Rectifier in a package of 0.37-mm thick with side solder pads

The new low forward voltage Schottky rectifiers from NXP Semiconductors are available in a package measuring 1.6 x 0.8 mm outline and a thickness of just 0.37mm. The new DFN1608D-2 (SOD1608) plastic package is claimed by NXP as the smallest in the market with current rating of 1.5 Amperes. Suggested applications of these diodes includes battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5A types, these can be extended to larger devices such as tablet PCs.

The DFN1608D-2 also feature tin plated side pads allowing side solderability.

Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: "These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size. Tailored to the needs of ultra-thin applications such as smartphones, we have created the flattest leadless plastic package on the market for 1A and above, with performance parameters found only in devices more than four times larger in size today. This portfolio is another great example of innovative, customer-driven design from NXP."
Features
Average forward current: IF(AV) up to 1.5A
Reverse voltage: VR up to 40V
Low forward voltage VF down to 410 mV
Low reverse current
AEC-Q101 qualified

Availability:

Already released and in mass production:
PMEG2005EPK, 20V, 0.5A
PMEG2010EPK, 20V, 1A

Design-in samples available, with mass production starting in March 2012:
PMEG2015EPK, 20V, 1.5A
PMEG4005EPK, 40V, 0.5A
PMEG4010EPK, 40V, 1A
PMEG4015EPK, 40V, 1.5A