Date: 01/02/2012

Mentor release 8.2 version of HyperLynx for complex PCB design

Mentor Graphics Corporation has released the version 8.2 of its HyperLynx PCB design software, which includes 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Mentor says analysis of today's multi-GHz SERDES channel interconnects-such as PCIe-Gen 3-requires specialized 3D modeling for accurate signal integrity analysis.

The product highlights and key specs include:
Integration of the HyperLynx Thermal analysis with the HyperLynx PI (power integrity) products to calculate the affects of heat generated by areas of high current density in complex power distribution networks (PDNs) on the PCB.

Using a new feature in the HyperLynx 8.2 product, analysis is performed with 3D full-wave models for structures such as vias, and with 2D/2.5D solutions for constructs such as traces.

Includes co-simulation between power integrity DC and thermal analysis to reflect the combination of heating of the PDNs and heat dissipation from the components, and the increased copper resistivity due to this heating. These integrated products now alert the designer to possible product failures due to excessive heat, as well as possible signal/power integrity performance issues.

"We've used the new HyperLynx LineSim interface 3D EM solver to analyze our vias for very high-speed interconnects," said Yanfeng Yu, principal engineer, ZTE Corporation. "This feature is one of the must-have features for serial channel design. It's easy to use and the performance is very good."

"This merging of signal/power integrity and thermal analysis is yet another example of how once isolated design disciplines are affecting each other," said Dave Kohlmeier, director of analysis products, Systems Design Division, Mentor Graphics. "Mentor's strategy of creating an integrated suite of analysis tools that allow collaboration among the many disciplines involved in the product development process is enabling our customers to deliver more advanced and competitive products to market faster and with higher quality."

The HyperLynx release 8.2 will start volume shipments in February and is featured at the Mentor Graphics booth #607 during DesignCon 2012 in Santa Clara, California, January 31-February 1, 2012.

For more info visit www.mentor.com/pcb/hyperlynx.