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  Date: 22/11/2011

2-3 Amp capable power transistors in 2x2-mm package

NXP Semiconductors N.V.has announced medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offered in a DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is claimed by NXP as industry's first such medium power transistor of this size.

NXP says this transistor is ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps. With Ptot levels of up to 1.1 W, this transistor designed to generate less heat. All NXP medium power transistors are automotive-qualified according to AEC-Q101.

"With our latest miniaturized medium power transistor, we continue to drive the market in compact components and in high performance low VCEsat transistors. NXP is the first vendor to offer such a broadly differentiated choice of transistors in a tiny 2-mm x 2-mm 3-pin package, significantly expanding design options for engineers," said Joachim Stange, product manager, NXP Semiconductors. "In charging circuits of mobile devices, tablet PCs and automotive electronics requiring smaller ICs, designers can now choose a medium power solution and not have to trade off PCB space for functionality. Simple applications such as interior car lighting which require only 1-2 Watts can be powered by an ultra-compact medium power solution."

Key Features of NXP Medium Power Transistors as per NXP:
High current in a small leadless package with medium power capability
Exposed heat sink for excellent thermal and electrical performance
VCEO ranging from 20 V to 80 V
High collector current capability IC (up to 2A) and ICM (up to 3A)
Automotive AEC Q101 qualified

Pricing and Availability: The new medium power transistors are available now. Pricing in high volume starts at USD $0.10.

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