Date: 20/09/2011

LGA 2011 socket from TE for Intel's Core i7 and Xeon 5 processor chips

TE Connectivity (TE), formerly Tyco Electronics, announces a new surface-mount LGA 2011 socket for Intel Corporation's Core i7 and Xeon 5 CPU processors. For detailed information on TE's LGA 2011 socket, please visit http://www.tycoelectronics.com/catalog/minf/en/493?BML=10576,17578,17575.

Billy Hsieh, product manager at TE comments: "The LGA 2011 socket is validated to Intel's design guides. TE is one of the few suppliers capable of offering this technology."

The contacts of the LGA 2011 socket have solder balls for surface mounting onto the printed circuit board (PCB). The product's hex ball array provides a stronger housing and minimizes the space that the 2011 balls occupy. The socket boasts an integrated lever mechanism (ILM) that generates the Z-axis compression load; its robust backer plate limits PCB bowing during compression.

The product is available in either 15u or 30u gold contact plating, which enhances product performance. TE provides a complete socket and hardware system, while the ILM and backer plate must be ordered separately.