Date: 04/08/2011

New MEMS device from ST measure 3 axis of both angular and linear motion

STMicroelectronics has expanded its portfolio with a new device LSM330DL that combines three-axis sensing of both linear and angular motion targets advanced motion-sensing applications, including remote controls, black-box recorders, and enhanced GPS systems.

ST says LSM330DL multi-sensor module detects acceleration up to 16g and angular rate up to 2,000 dps along the pitch, roll and yaw axes and the integration of a 3-axis digital accelerometer with a 3-axis digital gyroscope in a single device increases system robustness and the advanced design of the mechanical sensing structure guarantees outstanding thermal and mechanical stability.

Addressing energy efficiency on chip and at the system level, the motion-sensing modules includes power-down and sleep modes and an embedded FIFO (first-in first-out) memory block, which removes the need for continuous communication between the module and the host processor and operate with any supply voltage in the range of 2.4 to 3.6V.

ST's newest gyro-accelerometer 6-axis combo chip targets a wide range of applications that include intuitive user interfaces in pointers and remotes; motion monitoring in black-box recorders; dead-reckoning and map-matching in advanced navigation systems; and smart power-saving and free-fall detection in portable electronics.

The module leverages the micro machining technology process. The device is pin-to-pin and software-compatible with the recently announced five-degrees-of-freedom LSM320DL module, so customers can easily 'hot swap' and protect their investment in application development says ST.

Available: Now
price: $3.80 each for 1K pieces
For more information visit: www.st.com