Date: 25/03/2011

Xincomm' LTE baseband chips to use CEVA DSP Core

China based Xincomm Communications has licensed the CEVA-X DSP to power its next-generation TDD/FDD-LTE UE baseband SoC.

"We are pleased to be working with the world's leading licensor of DSPs for our next-generation LTE baseband chipsets," said Xiangguo Tang, CEO of Xincomm. "The CEVA-X DSP delivers the optimal balance of performance and programmability while lowering the overall cost of deployment for our LTE processors. This unique combination enables us to efficiently address mass market LTE chipset requirements targeting China and beyond."

"A new era of 4G connectivity based on the LTE standard opens the door to a host of new companies like Xincomm to address this lucrative market," said Eran Briman, vice president of marketing at CEVA. "Their team's previous experience in developing high-performance, low power connectivity chipsets will serve them well as they turn their focus to LTE terminals. Licensing our CEVA-X DSP lowers Xincomm's overall cost of ownership for developing their LTE chipsets, while also providing a clear roadmap to LTE Advanced."

CEVA's wireless customer base includes Mindspeed, Broadcom, Intel, Samsung, Spreadtrum, ST-Ericsson, VIA Telecom and now Xincomm. Ceva says including 12 design wins for LTE, it has more than 35 cellular baseband design wins to date and more than 1 billion CEVA-powered cellular baseband processors have shipped.